Diameter: 9 microns
Silica Content 99.9%, free of impurities
High mechanical strength 6000 MPa
Elongation 7.7%
Low Shrinkage 1000 hrs @ 1000C < 1.5%
Density 2.2
Low Loss of Material Dk =3.74, Df=.0002 @ 10 GHz
Low Thermal Expansion CTE = .54 10^6K^-1
Ablative Material >1600 C